Film for metal film transfer, method for transferring metal film and method for manufacturing circuit board

Film for metal film transfer, method for transferring metal film and method for manufacturing circuit board

  • CN 101,622,916 A
  • Filed: 02/28/2008
  • Published: 01/06/2010
  • Est. Priority Date: 03/01/2007
  • Status: Active Application
First Claim
Patent Images

1. metal film transfer printing film, it is characterized in that:

  • this metal film transfer printing has support body layer with film;

    Be arranged on this support body layer by the release layer that water soluble polymer forms more than a kind that is selected among water-soluble cellulose resin, water-soluble polyester resin and the water soluble acrylic resin;

    With the metallic diaphragm that is formed on this release layer.

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