Method for preparing second-order laser blind hole by UV, acid etching and CO2

Method for preparing second-order laser blind hole by UV, acid etching and CO2

CN
  • CN 101,626,663 B
  • Filed: 07/11/2008
  • Issued: 03/21/2012
  • Est. Priority Date: 07/11/2008
  • Status: Active Grant
First Claim
Patent Images

1. technological process method of making the second order laser blind hole is characterized in that:

  • on the plate face of printed wiring board, paste dry film and exposure before the laser drill, the top layer copper sheet is not destroyed by liquid medicine when guaranteeing the flow etching;

    Remove blind hole site surface dry film, L1 layer copper sheet and L1-L2 interlayer resin with the UV laser drill then, form the single order blind hole;

    Remove second layer copper through acid etching again;

    Use the CO2 laser drill to remove L2-L3 interlayer resin at last, so far, whole second order laser blind hole completes.

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