Rigid and flexible circuit board and manufacture method thereof

Rigid and flexible circuit board and manufacture method thereof

  • CN 101,631,424 B
  • Filed: 10/24/2006
  • Issued: 07/03/2013
  • Est. Priority Date: 10/24/2006
  • Status: Active Grant
First Claim
Patent Images

1. a rigid and flexible circuit board is characterized in that, comprising:

  • Flexible substrate with conductive pattern;

    The inflexibility base material that on the horizontal direction of above-mentioned flexible substrate, disposes side by side;

    Cover above-mentioned flexible substrate and inflexibility base material, and the insulating barrier that at least one position of flexible substrate is exposed;

    Be formed on the conductive pattern on the above-mentioned insulating barrier,The conductive pattern of above-mentioned flexible substrate is electroplated with the conductive pattern on the above-mentioned insulating barrier to be connected,Wherein, above-mentioned insulating barrier only sandwiches the end of above-mentioned flexible substrate, comes the end of above-mentioned flexible substrate is supported and fixing.

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