Clad copper foil printed circuit board laminating plate of radiator

Clad copper foil printed circuit board laminating plate of radiator

  • CN 101,657,066 A
  • Filed: 08/14/2009
  • Published: 02/24/2010
  • Est. Priority Date: 08/14/2009
  • Status: Active Application
First Claim
Patent Images

1. , a kind of clad copper foil printed circuit board laminating plate of radiator comprises that being provided with several is used for copper foil printed circuit plate (1) and radiator (2) with LED luminescent diode solder pad (1-4), it is characterized in that, and be matrix with radiator (2);

  • Described radiator (2) is by insulating heat-conductive layer (3), with superimposed being bonded to one of copper foil printed circuit plate (1);

    On the whole surface outside the described pad (1-4) of being positioned at of copper foil printed circuit plate (1), be provided with insulation solder resist material layer (4).

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