Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

  • CN 101,667,528 A
  • Filed: 09/04/2009
  • Published: 03/10/2010
  • Est. Priority Date: 09/04/2008
  • Status: Active Application
First Claim
Patent Images

1. , a kind of device comprises:

  • Bonding head, it is arranged to catches first substrate that comprises the first metal gasket group;

    Supplemental support, it is arranged to catches second substrate that comprises the second metal gasket group;

    Aligner, it is arranged to aims at the described first metal gasket group with the second metal gasket group, thereby forms the metal gasket group of aiming at;

    Master mould member also, it is arranged to the metal gasket group of holding described aligning, and wherein said also master mould member is arranged to the reception reducibility gas;

    Converter, relevant motion that provides the repetition of the metal gasket group of described aligning is provided for it.

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