Dual side cooling integrated power device package and module and methods of manufacture

Dual side cooling integrated power device package and module and methods of manufacture

  • CN 101,681,897 B
  • Filed: 07/21/2008
  • Issued: 04/12/2017
  • Est. Priority Date: 07/27/2007
  • Status: Active Grant
First Claim
Patent Images

1. the semiconductor packages that a kind of part is encapsulated, it has:

  • The exposed top thermal folder in part, it has perpendicular to the topMultiple folded bent portions of the exposed tops part of portion'"'"'s hot line folder;

    And lead frame structure, it has three individuallySection:

    Control zone, the first high current section and the second high current section, wherein the plurality of folded bent portions and describedTwo high current sections contact, and three independent sections have exposed lower surface, wherein the lead frame structureThe section all lower surfaces it is completely coplanar.

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