Adhesive for circuit member connection

Adhesive for circuit member connection

  • CN 101,689,518 A
  • Filed: 07/09/2008
  • Published: 03/31/2010
  • Est. Priority Date: 07/11/2007
  • Status: Active Application
First Claim
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1. the adhesive for circuit member connection of a heat curing-type, it is characterized in that, constitute by resin combination and the composite oxide particle that is dispersed in this resin combination, described resin combination comprise the heat cross-linking resin and with the curing agent of this heat cross-linking resin reaction.

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