Planar lattice array (LGA) socket loading mechanism for mobile platform

Planar lattice array (LGA) socket loading mechanism for mobile platform

  • CN 101,689,536 B
  • Filed: 06/13/2008
  • Issued: 10/19/2016
  • Est. Priority Date: 06/27/2007
  • Status: Active Grant
First Claim
Patent Images

1. for encapsulating the method executing compressive load to planar lattice array (LGA), including:

  • Utilize the conductive plate of the one end being attached to heat pipe, directly to the pipe being installed on planar lattice array (LGA) base plate for packagingThe top surface of core applies the first pressure load, and wherein said conductive plate directly contacts the described top surface of described tube core;

    AndUtilize described heat pipe described conductive plate basal surface at least two leaf spring, directly seal to described planar lattice arrayThe top surface of dress substrate applies the second pressure load, wherein said at least two leaf spring and described land grid array package substrateTop surface directly contacts,Its dorsulum is arranged on the underface of the planar lattice array socket being provided with described land grid array package substrate, instituteState the lappet that backboard includes bending with an angle relative to described backboard.

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