Radiation curable resin composition and rapid prototyping process using the same

Radiation curable resin composition and rapid prototyping process using the same

  • CN 101,706,639 A
  • Filed: 05/01/2003
  • Published: 05/12/2010
  • Est. Priority Date: 05/03/2002
  • Status: Active Application
First Claim
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1. radiation-hardenable composition with respect to composition total weight, comprises:

  • The component of A 0-25 weight % with an ester linking group and two cyclohexene oxide groupsThe component that contains epoxide group of the non-component A of B 10-85 weight %The component of the oxetane group-containing of C 1-29 weight %The polyfunctional acrylic ester of D 1-25 weight %The free radical photo-initiation of E 0.1-10 weight %The cation light initiator of F 0.1-10 weight %Wherein form the Seterolithography object;

    form composition layer and optionally use optical radiation radiation composition layer by repeating the following step, then after solidifying in the instrument, the back solidified 60 minutes, in temperature is that 20 ℃ and

    relative humidity are to regulate object 48 hours continuously under the condition of 80%RH, and the object that obtains like this has at least a following performance;

    (i) bending modulus is between 500-10000MPa;

    (ii) the average elongation amount when breaking is at least 3%;

    With(iii) pulling strengrth is 25MPa at least.

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