Wafer-level package with column-shaped projection coated with solder

Wafer-level package with column-shaped projection coated with solder

  • CN 101,728,287 A
  • Filed: 09/16/2009
  • Published: 06/09/2010
  • Est. Priority Date: 10/23/2008
  • Status: Active Application
First Claim
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1. the method for processed wafer level encapsulation comprises:

  • At least one active device of processing on the semiconductor wafer that is not also having to split, described active device have a plurality of lands that the upper surface at described wafer exposes;

    AndBefore splitting described semiconductor wafer;

    (i) on described a plurality of lands, form the column-shaped projection of a plurality of correspondences, (ii) on described semiconductor wafer, apply the molded seal layer then, make that each the top in a plurality of column-shaped projections is exposed.

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