Polishing composition

Polishing composition

  • CN 101,743,624 B
  • Filed: 06/09/2008
  • Issued: 07/02/2014
  • Est. Priority Date: 06/08/2007
  • Status: Active Grant
First Claim
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1. a composition for polishing, it is characterized in that, it contains the median size of trying to achieve by the particle size distribution of employing light scattering method is more than 20nm but the colloid silica of not enough 80nm and the oxygenant that passive state holding current value is 0mA~

  • 0.5mA, the content of described colloid silica is 3 % by weight~

    40 % by weight of composition for polishing total amount, the content of described oxygenant is 0.1 % by weight~

    7 % by weight of composition for polishing total amount, and the pH of described composition for polishing is 1.0~

    2.0.

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