Chemical-mechanical polishing solution

Chemical-mechanical polishing solution

  • CN 101,747,842 B
  • Filed: 12/19/2008
  • Issued: 12/31/2014
  • Est. Priority Date: 12/19/2008
  • Status: Active Grant
First Claim
Patent Images

1. the application of chemical mechanical polishing liquid in the removal rate selection ratio reducing polysilicon and silicon-dioxide, it contains one or more star-type polymers containing pigment affinity groups, abrasive grains and water.

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