Light emitting device package and method of manufacturing the same

Light emitting device package and method of manufacturing the same

  • CN 101,755,348 A
  • Filed: 07/23/2008
  • Published: 06/23/2010
  • Est. Priority Date: 07/25/2007
  • Status: Active Application
First Claim
Patent Images

1. luminescent device encapsulation comprises:

  • The substrate that comprises a plurality of juts;

    Insulating barrier on the described substrate;

    Metal level on the described insulating barrier;

    AndBe electrically connected to the luminescent device of described metal level on the described substrate.

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