Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device

Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device

  • CN 101,765,646 B
  • Filed: 07/31/2008
  • Issued: 03/04/2015
  • Est. Priority Date: 07/31/2007
  • Status: Active Grant
First Claim
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1. a liquid resin composition for adhesive, it is at least containing epoxy curing agent (C) and the curing catalyst (D) in solvent (A), the epoxy resin (B) in a part with two or more epoxy group(ing), a part with two or more phenolic hydroxyl group, it is characterized in thatThe boiling point of this solvent (A) is 200 ~ 260 DEG C,This curing catalyst (D) is the curing catalyst represented with following general formula (1), the curing catalyst represented with following general formula (4) or the curing catalyst represented with following general formula (6),This epoxy resin (B) and this epoxy curing agent (C) are dissolved in this solvent (A),The change of state temperature of this curing catalyst (D) is 100 ~ 160 DEG C,

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