Thermal assisted recording head and manufacture method thereof

Thermal assisted recording head and manufacture method thereof

  • CN 101,783,143 B
  • Filed: 12/31/2009
  • Issued: 01/20/2016
  • Est. Priority Date: 12/31/2008
  • Status: Active Grant
First Claim
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1. , for the manufacture of a method for thermal assisted recording head, comprising:

  • Form near field transducer structure;

    Remove a part of described near field transducer structure;

    Form the covering adjacent with the remainder of described near field transducer structure, wherein the described covering of part extends along the described remainder of described near field transducer structure;

    AndDescribed covering forms sandwich layer.

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