Method for handling a semiconductor wafer assembly

Method for handling a semiconductor wafer assembly

  • CN 101,785,085 A
  • Filed: 06/04/2008
  • Published: 07/21/2010
  • Est. Priority Date: 06/05/2007
  • Status: Active Application
First Claim
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1. method comprises:

  • One wafer assembly is provided, and described wafer assembly comprises the one or more semiconductor grains that are disposed on the carrier substrate;

    Deposition at least two metal levels are on described one or more semiconductor grains, to produce at least a portion of a metal substrate;

    Remove described carrier substrate from described wafer assembly;

    AndOperate described wafer assembly in order to implement further processing via described metal substrate.

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