Lead-free solder for vehicle, and in-vehicle electronic circuit

Lead-free solder for vehicle, and in-vehicle electronic circuit

  • CN 101,801,588 A
  • Filed: 07/14/2008
  • Published: 08/11/2010
  • Est. Priority Date: 07/13/2007
  • Status: Active Application
First Claim
Patent Images

1. a vehicle mounted lead-free solder is characterized in that, comprises the Cu of Bi, 0.8~

  • 1.2 quality % of Ag, 1.5~

    6 quality % of 2.8~

    4 quality % and the Sn of surplus.

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