Lead-free solder for vehicle, and in-vehicle electronic circuit

Lead-free solder for vehicle, and in-vehicle electronic circuit

  • CN 101,801,588 B
  • Filed: 07/14/2008
  • Issued: 03/25/2015
  • Est. Priority Date: 07/13/2007
  • Status: Active Grant
First Claim
Patent Images

1. a vehicle electronic circuit lead-free solder for heat-resisting cyclicity excellence, is characterized in that,Comprise the Ag of 2.8 ~ 4 quality %, the Sn be selected from by least a kind in the group that Ni, Fe and Co are formed and residual content that the Bi of 1.5 ~ 6 quality %, the Cu of 0.8 ~ 1.2 quality %, total amount are 0.005 ~ 0.05 quality %,And keep 30 minutes respectively at-55 DEG C ~+125 DEG C, be operating as 1 circulation with this, carry out 1500 circulations, the bond strength at the junction surface of chip element is average more than 20N, and minimum value is more than 15N,The liquidus temperature of described solder is less than 240 DEG C,Described solder has precipitate post-equalization type sosoloid tissue.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×