Be formed for improving the method for nano coating of first order interconnection in the microelectronics Packaging and the bonding between the epoxy resin bottom filling and the structure that forms thus

Be formed for improving the method for nano coating of first order interconnection in the microelectronics Packaging and the bonding between the epoxy resin bottom filling and the structure that forms thus

  • CN 101,803,014 A
  • Filed: 09/03/2008
  • Published: 08/11/2010
  • Est. Priority Date: 09/11/2007
  • Status: Active Application
First Claim
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1. method comprises:

  • Utilize at least a coating in functionalized nano granulosa and the nano wire layer to be arranged on interconnection structure on the tube core, wherein said functionalized nano grain is dispersed in the solvent;

    Heating comprises at least a described layer in functionalized nano granulosa and the nano wire layer, to remove the part of described solvent;

    AndOn described coated interconnection structure, apply bottom filling.

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