Semiconductor die package and preparation method thereof

Semiconductor die package and preparation method thereof

  • CN 101,807,533 A
  • Filed: 06/19/2006
  • Published: 08/18/2010
  • Est. Priority Date: 06/30/2005
  • Status: Active Application
First Claim
Patent Images

1. method comprises:

  • Acquisition comprises the pre-molded substrate of first surface and second surface, wherein said pre-molded substrate comprises lead frame structure and moulding material, wherein said lead frame structure comprises pad area, the outer surface of wherein said pad area and the outer surface of described moulding material be coplane basically, and overlaps with the described second surface of described pre-molded substrate;

    AndAt least two semiconductor elements are attached to the described first surface of pre-molding substrate.

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