Semiconductor die package and preparation method thereof

Semiconductor die package and preparation method thereof

  • CN 101,807,533 B
  • Filed: 06/19/2006
  • Issued: 03/09/2016
  • Est. Priority Date: 06/30/2005
  • Status: Active Grant
First Claim
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1. a method, comprising:

  • Obtain the pre-molded substrate comprising first surface and second surface,Wherein said pre-molded substrate comprises lead frame structure and moulding material,Wherein said lead frame structure comprises pad area, and described pad area has outer surface and inner surface,And the outer surface of the described outer surface of wherein said pad area and described moulding material is coplanar, and overlap with the described second surface of described pre-molded substrate,And wherein said first surface comprises moulding material, and the described inner surface portion ground of the described pad area of described lead frame structure is covered by moulding material;

    AndAt least two semiconductor elements are attached to the described first surface of described pre-molded substrate,Wherein at least one tube core is attached to the described moulding material on described pad area by adhesive;

    A semiconductor element in wherein said semiconductor element is attached to not by the surface of the moulding material of described pad area covering;

    AndWherein said moulding material makes to be attached to the described semiconductor element of described moulding material and described pad area electric isolution.

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