Bump I/O contact for semiconductor device

Bump I/O contact for semiconductor device

  • CN 101,821,843 A
  • Filed: 09/23/2008
  • Published: 09/01/2010
  • Est. Priority Date: 10/11/2007
  • Status: Active Application
First Claim
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1. one kind is used for projection contact that suprabasil conductor and the contact mat that is installed on the semiconductor device of described substrate are electrically connected, and described projection contact comprises:

  • A. it is first and second extreme that conductive pole, described conductive pole have, and described first end of described post can be realized the electric contact and the mechanical attachment of the described contact mat of described post to the described semiconductor device, and wherein said post is outwards outstanding from described semiconductor device;

    B. scolder is preced with, it is first and second extreme that described scolder hat has, described scolder hat be placed as with described axis of a cylinder to aiming at, described first end face of wherein said scolder hat is to described second end of described post, but described scolder hat is Reflow Soldering in predetermined temperature, contacts and mechanical attachment with the electric of described suprabasil described conductor with described second end of realizing described scolder hat;

    AndC. diffusion impervious layer, described diffusion impervious layer electrically and mechanically is attached to described second end of described post with described first end of described solder bump, and described diffusion impervious layer opposing is by the electromigration in described first end of described scolder hat of the chemical composition of the selection of described post.

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