Semiconductor flip-chip bonding packaging heat radiation improved structure

Semiconductor flip-chip bonding packaging heat radiation improved structure

  • CN 101,834,163 A
  • Filed: 04/29/2010
  • Published: 09/15/2010
  • Est. Priority Date: 04/29/2010
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor flip-chip bonding packaging heat radiation improved structure comprises chip (2), electric interconnecting material (3), lead frame (4) and plastic packaging material (6), it is characterized in that, also comprises spring radiator (1) in the described packaging heat dissipation improved structure;

  • Described lead frame (4) is provided with transmission pin (5);

    The front of described chip (2) is implanted with described electric interconnecting material (3), and upside-down mounting is on described transmission pin (5);

    The described spring radiator of described plastic packaging material (6) plastic packaging (1), chip (2), electric interconnecting material (3) and lead frame (4), form plastic-sealed body, described spring radiator (1) is fixing by described plastic packaging material (6) on every side, the one end links to each other with described chip (2), and the other end is exposed to described plastic-sealed body surface.

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