Improved method for semi-conductor flip-chip bonding package cooling

Improved method for semi-conductor flip-chip bonding package cooling

  • CN 101,840,868 B
  • Filed: 04/29/2010
  • Issued: 11/26/2014
  • Est. Priority Date: 04/29/2010
  • Status: Active Grant
First Claim
Patent Images

1. a semi-conductor flip-chip bonding package cooling manufacture method, is characterized in that, comprises the following steps:

  • (1) get a slice semi-conductor flip-chip bonding encapsulation lead frame;

    (2) flip-chip that front is implanted with to electric interconnecting material is on the transmission pin of lead frame;

    (3) with bonding material, spring radiator is bonded to chip back, one end of spring radiator is connected with chip;

    (4) the semi-finished product plastic packaging material of implanting operation to completing spring radiator is sealed operation, makes the other end of sealing rear spring radiator be exposed to plastic-sealed body surface, and the semi-finished product after sealing are carried out to rear curing operation;

    (5) by independent semiconductor package body arranged together separated, form semiconductor flip-chip bonding packaging heat radiation improved packaging body.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×