Method for dividing substrate

Method for dividing substrate

  • CN 101,844,275 A
  • Filed: 03/25/2010
  • Published: 09/29/2010
  • Est. Priority Date: 03/25/2009
  • Status: Active Application
First Claim
Patent Images

1. method for dividing substrate comprises:

  • Make UV laser beam in the vibration of the substrate upper edge of panel line of cut, in described substrate, to form the line of rabbet joint;

    AndCut described panel by power being put on described panel in described line of rabbet joint punishment.

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