Photosensitive resin composition, and dry film and printed wiring board using the same

Photosensitive resin composition, and dry film and printed wiring board using the same

  • CN 101,852,988 A
  • Filed: 03/29/2010
  • Published: 10/06/2010
  • Est. Priority Date: 03/30/2009
  • Status: Active Application
First Claim
Patent Images

1. a photosensitive polymer combination is characterized in that, in the photosensitive polymer combination of the alkali-developable that contains carboxy resin (B) and Photoepolymerizationinitiater initiater (D), further contains the multiple oxyhydroxide (A) of stratiform.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×