Utilize the substrate brush scrubbing of compatible chemicals and close to cleaning-drying program, close to substrate preparation procedure with implement the method, apparatus and system of foregoing routine

Utilize the substrate brush scrubbing of compatible chemicals and close to cleaning-drying program, close to substrate preparation procedure with implement the method, apparatus and system of foregoing routine

  • CN 101,853,781 B
  • Filed: 03/25/2005
  • Issued: 08/19/2015
  • Est. Priority Date: 03/31/2004
  • Status: Active Grant
First Claim
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1. , for a clean method with the front and back of drying of semiconductor substrate, described method comprises:

  • Use the back side of semiconductor substrate described in brush scrubbing chemicals brush scrubbing;

    With formation front, the front meniscus of described semiconductor substrate, and with the formation back side, the back side meniscus of described semiconductor substrate, described front meniscus and described back side meniscus be formed in the back side described in brush scrubbing after perform;

    AndMove by making described front meniscus along the front of described semiconductor substrate and make described back side meniscus move along the back side of described semiconductor substrate and scan the front of described semiconductor substrate and the back side of described semiconductor substrate, described front meniscus and described back side meniscus use the chemicals compatible with described brush scrubbing chemicals to be formedThe front of wherein said substrate and scanning of the back side of described substrate are configured to clean and the front of dry described substrate and the back side of described substrate.

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