Packaging structure, sealing compound module and sealing compound mold for packaging same

Packaging structure, sealing compound module and sealing compound mold for packaging same

  • CN 101,859,690 A
  • Filed: 04/10/2009
  • Published: 10/13/2010
  • Est. Priority Date: 04/10/2009
  • Status: Active Application
First Claim
Patent Images

1. a sealing module (encapsulating module), in order to encapsulate a substrate that is provided with a chip, so that this substrate and this Chip Packaging are become an encapsulating structure, this sealing module comprises:

  • One sealing bed die is in order to carry this substrate;

    AndOne dies with epoxy compound (encapsulating mold), have a bearing surface, one first level and smooth (smooth) curved surface and a die cavity, this first smooth surface has a radius of curvature and is connected and is positioned at the opening part of this die cavity with this bearing surface, wherein, when this dies with epoxy compound and this sealing bed die matched moulds during with this substrate of clamping, this this substrate of bearing surface butt.

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