Packaging structure, sealing compound module and sealing compound mold for packaging same

Packaging structure, sealing compound module and sealing compound mold for packaging same

  • CN 101,859,690 B
  • Filed: 04/10/2009
  • Issued: 09/05/2012
  • Est. Priority Date: 04/10/2009
  • Status: Active Grant
First Claim
Patent Images

1. a sealing module (encapsulating module), in order to encapsulate one be provided with a chip substrate, so that this substrate and this Chip Packaging are become an encapsulating structure, this sealing module comprises:

  • One sealing bed die is in order to carry this substrate;

    AndOne dies with epoxy compound (encapsulating mold);

    Have a bearing surface, one first level and smooth (smooth) curved surface and a die cavity;

    This first smooth surface has a radius of curvature and is connected and is positioned at the opening part of this die cavity with this bearing surface;

    Wherein, when this dies with epoxy compound and this sealing bed die matched moulds during with this substrate of clamping, this this substrate of bearing surface butt.

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