Method for processing a semiconductor wafer and semiconductor fabrication apparatus using the method

Method for processing a semiconductor wafer and semiconductor fabrication apparatus using the method

  • CN 101,877,303 A
  • Filed: 01/12/2010
  • Published: 11/03/2010
  • Est. Priority Date: 04/30/2009
  • Status: Active Grant
First Claim
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1. method of handling wafer comprises:

  • Measure the data of expression chip warpage amount;

    According to the amount of warpage of having measured, determine at least two different control voltages, and above-mentioned control voltage is applied to the relevant position of wafer by an electrostatic wafer holder;

    AndWhen on wafer, carrying out technology, apply above-mentioned at least two different control voltages, in order to the relevant position of holding chip, whereinAbove-mentioned measurement represents that the step of the data of chip warpage comprises the height with a plurality of positions of laser measurement upper wafer surface, and immediately is performed in the semiconductor manufacturing facility during manufacture.

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