Chip assembly, connecting assembly, led and method for producing a chip assembly

Chip assembly, connecting assembly, led and method for producing a chip assembly

  • CN 101,878,544 A
  • Filed: 11/21/2008
  • Published: 11/03/2010
  • Est. Priority Date: 11/28/2007
  • Status: Active Application
First Claim
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1. a chip apparatus that is used for opto-electronic device has semiconductor chip (1) and jockey (2) that at least one launches electromagnetic radiation, wherein:

  • -jockey (2) has the plane (3,4) that is electrically insulated from each other,-at least two planes (3,4), be provided with at least two by the conductor of electric insulation (9,10),-at least one plane (3,4) has chamber (6),-semiconductor chip (1) is arranged in the chamber (6) and has at least two connecting portions (7,8),Each of-connecting portion (7,8) connects with one of conductor (9,10) conduction respectively, and-at least one described plane (4) is the heat radiation plane.

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