Interconnecting assembly, manufacture method and repairing method thereof

Interconnecting assembly, manufacture method and repairing method thereof

CN
  • CN 101,887,881 B
  • Filed: 05/12/2009
  • Issued: 11/28/2012
  • Est. Priority Date: 05/12/2009
  • Status: Active Grant
First Claim
Patent Images

1. interconnecting assembly comprises:

  • Substrate;

    First conductive layer is positioned at the first area upper surface of said substrate;

    Second conductive layer is positioned at the second area upper surface of said substrate;

    Insulating barrier covers said first conductive layer;

    Interconnection layer is through said first conductive layer of the contact hole conductive interconnection on the contact hole on first conductive layer and second conductive layer and said second conductive layer;

    It is characterized in that also comprise repair structure, said repair structure is a conductive layer, be positioned at said first conductive layer and/or second conductive layer top.

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