The manufacture method of solid photographic device, electronic installation and this solid photographic device

The manufacture method of solid photographic device, electronic installation and this solid photographic device

  • CN 101,887,899 A
  • Filed: 05/04/2010
  • Published: 11/17/2010
  • Est. Priority Date: 05/12/2009
  • Status: Active Application
First Claim
Patent Images

1. solid photographic device, it comprises:

  • Semiconductor substrate has a plurality of photodiodes on it, this semiconductor substrate comprises the first wiring portion, the second wiring portion and the 3rd wiring portion;

    First wiring layer on described semiconductor substrate, this first wiring layer comprise all described wiring portions of a plurality of metal films and extend through;

    AndSecond wiring layer on described first wiring layer, described first wiring portion of this second wiring layer extend through and the described second wiring portion.

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