Methods of fluxless micro-piercing of solder balls, and resulting devices

Methods of fluxless micro-piercing of solder balls, and resulting devices

  • CN 101,904,230 A
  • Filed: 12/03/2008
  • Published: 12/01/2010
  • Est. Priority Date: 12/18/2007
  • Status: Active Grant
First Claim
Patent Images

1. method, it comprises:

  • Above substrate, form conductive material layer;

    Above described conductive material layer, form masking layer;

    Be at described masking layer and on described conductive material layer, carry out first etch process under the situation of appropriate location;

    Remove described masking layer;

    AndAfter removing described masking layer, on described conductive material layer, carry out isotropic etching, define a plurality of perforation integrated structures that are positioned on the described substrate whereby.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×