Lead frame and packaging structure therewith

Lead frame and packaging structure therewith

  • CN 101,908,519 A
  • Filed: 06/02/2009
  • Published: 12/08/2010
  • Est. Priority Date: 06/02/2009
  • Status: Active Application
First Claim
Patent Images

1. packaging structure with lead frame, it is characterized in that:

  • described packaging structure with lead frame comprises;

    One lead frame, comprise a chip bearing and a plurality of pin, described chip bearing has an end face and a bottom surface, and described bottom surface is concaved with at least two annular recess, each described annular recess is to be continuous annular, and described a plurality of pins are arranged around around the described chip bearing;

    At least one semiconductor chip is located on the described end face of described chip bearing;

    Plural wires, wherein each described lead electrically connects described semiconductor chip respectively to each described pin;

    AndOne packing colloid coats the part of described chip bearing, described semiconductor chip, described plural wires and described a plurality of pins, and described packing colloid inserts in the described annular recess, to form at least two ring-type clip protuberances.

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