Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

  • CN 101,924,055 A
  • Filed: 06/12/2010
  • Published: 12/22/2010
  • Est. Priority Date: 06/15/2009
  • Status: Active Application
First Claim
Patent Images

1. dicing tape-integrated film for semiconductor back surface, it comprises:

  • Cutting belt, described cutting belt comprise base material and the pressure sensitive adhesive layer that is arranged on the described base material;

    WithFlip-chip semiconductor back side film, the described flip-chip semiconductor back side is arranged on the described pressure sensitive adhesive layer with film,By comprising thermoset resin components and forming as the thermoplastic resin component'"'"'s of selectable components resin combination, described thermoplastic resin component'"'"'s amount is less than 50 weight % with respect to the resin Composition total amount with film at the wherein said flip-chip semiconductor back side.

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