Solutions
Empower Patent Analytics
Empower Litigation Defense
Empower License Manager
Use Cases
Patent Licensing
Portfolio Management
Litigation Strategy
Market Intelligence
Data Platform
Contact Us
Login
×
View as Organization
Dicing tape-integrated film for semiconductor back surface
Dicing tape-integrated film for semiconductor back surface
CN 101,924,055 A
Filed
: 06/12/2010
Published
: 12/22/2010
Est. Priority Date
: 06/15/2009
Status
: Active Application
EN
CH
Pin
Subscription Required
This content requires a subscription to view
Contact Us
or
Login
×
×