Method of fabricating composite structure with stable bonding layer of oxide

Method of fabricating composite structure with stable bonding layer of oxide

  • CN 101,925,994 B
  • Filed: 12/29/2008
  • Issued: 05/17/2017
  • Est. Priority Date: 01/21/2008
  • Status: Active Grant
First Claim
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1. a kind of method of manufacture composite construction, the composite construction combines thin film in carrier substrates comprising at least one of which,By the average thermal expansion system of formation of deposits bonding layer of oxide, the thin film and carrier substrates between carrier substrates and thin filmNumber is 7 ×

  • 10-6K-1Or it is higher, it is characterised in thatThe bonding layer of oxide is heavy by the low pressure chemical phase on the faying face of carrier substrates and/or the faying face of thin filmAccumulate (LPCVD) oxide skin(coating) to be formed, andThe thickness of thin film is 5 microns or lower, andThe thickness of the oxide skin(coating) is more than or equal to the thickness of thin film, andWherein with reference to front, methods described also include to by low-pressure chemical vapor deposition in the faying face of carrier substrates and/orThe step of oxide skin(coating) deposited on the faying face of thin film carries out densification heat treatment, and higher than deposition oxide binder coursesAt a temperature of implement the densification heat treatment step;

    Wherein carrier substrates are made up of at least one material selected from llowing group of materials:

    Sapphire, LiTaO3

    LiNbO3

    MgO、

    WithAlloy.

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