For the method manufacturing the device including at least two difference parts interconnected by interconnection line and the device obtained

For the method manufacturing the device including at least two difference parts interconnected by interconnection line and the device obtained

  • CN 101,946,566 B
  • Filed: 12/04/2008
  • Issued: 09/07/2016
  • Est. Priority Date: 12/13/2007
  • Status: Active Grant
First Claim
Patent Images

1. for manufacturing the method for device including at least two difference parts, described at leastTwo different parts are interconnected on substrate by least one interconnection line, it is characterised in that described sideMethod comprises the following steps:

  • -according to predetermined interconnection pattern, by sinking at substrate (2,2f, 2b) the continuous wiring technique of upper employingLong-pending continuous wiring produces interconnection line (3), and described line includes that at least one connects portion of terminal (7,8),This at least one connection portion of terminal is exposed on substrate,-make at least one contact (5,6) of parts (C1, C3) towards portion of terminal (7b, 8b), and willThis contact is connected to this portion of terminal.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×