Mold release film and process for producing flexible printed wiring board therewith

Mold release film and process for producing flexible printed wiring board therewith

  • CN 101,961,937 A
  • Filed: 06/29/2004
  • Published: 02/02/2011
  • Est. Priority Date: 07/01/2003
  • Status: Active Application
First Claim
Patent Images

1. one kind is used for the mould release membrance flexible or lamination step that the rigidity flexible print wiring board is made, and it comprises the release layer that is made of the resin based on polybutylene terephthalate (PBT).

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