Intrinsic flame-retardant epoxy resin composition for semiconductor package

Intrinsic flame-retardant epoxy resin composition for semiconductor package

  • CN 101,962,466 B
  • Filed: 09/25/2010
  • Issued: 01/04/2012
  • Est. Priority Date: 09/25/2010
  • Status: Active Grant
First Claim
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1. semiconductor-sealing-purpose intrinsic fire retarded epoxy resin composition, it is characterized in that:

  • it is made up of following materials of weight proportions,Intrinsic fire-retardant epoxy resin 5~

    30;

    Intrinsic flame retardant type resol 5~

    20;

    Mineral filler 50~

    300;

    Curing catalyst 0.5~

    2.5;

    Coupling agent 0.5~

    4.5;

    Tinting material 0.1~

    5;

    Releasing agent 0.1~

    4.5;

    Described intrinsic fire-retardant epoxy resin is that general formula is the epoxy resin of (I);

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