Printed circuit board test assisting apparatus and printed circuit board test assisting method

Printed circuit board test assisting apparatus and printed circuit board test assisting method

  • CN 101,963,651 B
  • Filed: 07/21/2010
  • Issued: 02/11/2015
  • Est. Priority Date: 07/22/2009
  • Status: Active Grant
First Claim
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1. an equipment for the test of auxiliary formation wiring pattern on a printed circuit, described equipment comprises:

  • First database, the mode that this first database is associated with described wiring pattern to make to indicate the attribute of described wiring pattern and the attribute information of position and positional information, stores described attribute information and described positional information;

    Second database, this second database storing location information and dimension information, this positional information and the dimension information pattern indicated in the solid pattern being present in and being located in described printed circuit board (PCB) removes position and the size in region;

    3rd database, 3rd database purchase degradation information, this degradation information indicates and removes relative to described wiring pattern and described pattern the degradation that position relationship between region and described pattern remove the characteristics of signals in the size in region, described wiring pattern;

    Input block, this input block is transfused to the attribute information of wiring pattern;

    Degradation processing unit, this degradation processing unit removes the positional information in region and dimension information and described degradation information based on the positional information of the described wiring pattern corresponding with the attribute information being input to described input block, described pattern, obtains the degradation of the characteristics of signals in the described wiring pattern corresponding with the attribute information being input to described input block;

    AndFirst extraction unit, this first extraction unit extracts the wiring pattern that degradation is equal to or greater than predetermined extent and tests for actual measurement from the wiring pattern that degradation has been obtained by described degradation processing unit,Wherein, the area data that described degradation processing unit utilizes described pattern to remove region removes the dimension information in region to obtain the degradation of the characteristics of signals in described wiring pattern as described pattern,Wherein, described degradation processing unit divides described pattern with predetermined area unit and removes region, obtains the degradation of the characteristics of signals in described wiring pattern with each predetermined area unit removing region for described pattern, andWherein, each predetermined area unit has side, and this side determines based on the velocity of propagation of signal in fall time of the signal transmitted by described wiring pattern or rise time and described wiring pattern.

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