Wafer bonding apparatus

Wafer bonding apparatus

  • CN 101,965,241 B
  • Filed: 11/21/2008
  • Issued: 04/22/2015
  • Est. Priority Date: 11/21/2008
  • Status: Active Grant
First Claim
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1. a wafer bonding apparatus, is characterized in that, has:

  • First sample bench, it is located at engagement cavity indoor, keeps first substrate;

    Second sample bench, it is indoor that it is located at described engagement cavity, keeps the second substrate opposed with described first substrate;

    Load transmitting portion, it engages with the circumference of described first sample bench, and in the first mounting table, support described first sample bench, this load transmitting portion is used for by the load applying from described first mounting table applying in the circumference of described first sample bench, and it is indoor that this load transmitting portion is located at described engagement cavity;

    Drive unit, it by driving described first mounting table to move relative to described second sample bench in the described joint chamber of vacuum, by described first substrate and the crimping of described second substrate;

    Angle-adjusting mechanism, it is indoor that it is located at described engagement cavity, with can change described first sample bench towards mode in the first mounting table, support described first sample bench via described load transmitting portion,Described angle-adjusting mechanism has;

    Be fixed on the ball flange of described first sample bench;

    Be fixed on the ball seat of described first mounting table;

    The holding flange be made up of the segmentation ring being configured to the flange portion clamping described ball flange, it engages with the described flange portion of described ball flange by being fixed, and described ball flange is fixed on described ball seat,Described load transmitting portion is formed as roughly discoid, and described load transmitting portion is formed with depressed part in the central authorities in the face of described angle-adjusting mechanism side, and the face of described angle-adjusting mechanism side is formed with bearing-surface,Described load transmitting portion is supported on described ball flange to make the bearing-surface of described bearing-surface and described ball flange be close to and to be formed with empty mode in the central authorities being installed on the face of the supporting part of described ball flange of described load transmitting portion.

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