Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board

Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board

  • CN 101,981,502 A
  • Filed: 05/22/2009
  • Published: 02/23/2011
  • Est. Priority Date: 05/30/2008
  • Status: Active Application
First Claim
Patent Images

1. a photosensitive polymer combination is characterized in that, contains:

  • (A) have following general formula (I), (II) and (III) binder polymer of the divalent group of expression;

    (B) optical polymerism compound;

    And(C) Photoepolymerizationinitiater initiater,

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