Encapsulated lens stack

Encapsulated lens stack

  • CN 101,990,711 A
  • Filed: 11/18/2008
  • Published: 03/23/2011
  • Est. Priority Date: 11/27/2007
  • Status: Active Application
First Claim
Patent Images

1. wafer scale encapsulation, comprise the substrate of at least two outsides of piling up vertically, a plurality of cavity and a plurality of optical element that duplicates that is arranged in the cavity between substrate, wherein at least two optical elements are spaced from each other certain distance with finding vertically and are disposed in the common cavity, and wherein encapsulation comprises two smooth basically end faces, and these end faces are made of the outer surface of the substrate of outside.

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