Grinding pad and its application and its manufacture method

Grinding pad and its application and its manufacture method

  • CN 102,029,571 B
  • Filed: 09/24/2009
  • Issued: 07/29/2015
  • Est. Priority Date: 09/24/2009
  • Status: Active Grant
First Claim
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1. a grinding pad, it comprises:

  • Grinding layer, it comprises lapped face, and described lapped face is for grinding substrate, and wherein said grinding layer comprises fiber;

    Cushion, it comprises elastomer, and described elastomer has multiple connective hole, and the compression ratio of wherein said cushion is higher than the compression ratio of described grinding layer;

    Described cushion also comprises carrier, to make the structure of multiple connective hole formed thereon, the void content of wherein said cushion is 30% to 45%, the void content of described cushion is higher than the void content of described grinding layer, and wherein said carrier selects free film, weave cotton cloth and group that glass fibre forms;

    WithAdhesive layer, it is formed by the high molecular polymerization of tool mobility, for described cushion is bonded to described grinding layer.

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