Method for grinding semiconductor wafer

Method for grinding semiconductor wafer

  • CN 102,029,573 A
  • Filed: 09/29/2010
  • Published: 04/27/2011
  • Est. Priority Date: 10/07/2009
  • Status: Active Application
First Claim
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1. method that is used for process semiconductor wafers, wherein the side feeding each other of at least one milling tool and at least one semiconductor wafer is removed material from described at least one semiconductor wafer, its medium viscosity minimum 310 thus -3N/m 2.s and the highest by 10010 -3N/m 2.s liquid medium and is moved away from each other described at least one milling tool and described at least one semiconductor wafer between described at least one milling tool and described at least one semiconductor wafer, operates with end process.

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