Method for manufacturing printed wiring board

Method for manufacturing printed wiring board

  • CN 102,045,966 A
  • Filed: 08/21/2008
  • Published: 05/04/2011
  • Est. Priority Date: 09/20/2007
  • Status: Active Application
First Claim
Patent Images

1. manufacture method of using the printed substrate of supporting member, described supporting member comprise two-sided or single face metal surface and are layered in metal forming on the described metal surface that described manufacture method may further comprise the steps:

  • By the peripheral part of described metal forming is bonding or be engaged to described supporting member and fix described metal forming;

    On fixing described metal forming, form resin insulating barrier;

    In described resin insulating barrier, be formed for the opening of via conductor;

    On described resin insulating barrier, form conducting channel;

    Thereby in described opening, form the via conductor that is electrically connected described conducting channel and described metal forming and form duplexer;

    AndThereby peel off described metal forming from described supporting member cutting described duplexer than the position more in the inner part, position of fixing described metal forming.

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