Separating device and separating method for electronic component manufacture

Separating device and separating method for electronic component manufacture

  • CN 102,047,399 A
  • Filed: 06/09/2009
  • Published: 05/04/2011
  • Est. Priority Date: 06/13/2008
  • Status: Active Application
First Claim
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1. the slicing device of an electronic unit manufacturing usefulness, it uses when hermetic sealing substrate is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the slicing device of described electronic unit manufacturing usefulness possesses:

  • accept the carrier of hermetic sealing substrate;

    Cut hermetic sealing substrate partly and hermetic sealing substrate cut into monolithic or by cutting off the section portion that forms monolithic;

    And the unloading part that will send by a plurality of electronic units after the processing of this section portion, the slicing device of described electronic unit manufacturing usefulness is characterised in that,Between described carrier and described unloading part, be provided with a plurality of described section portion,Each section portion of a plurality of described section portion can dismounting with respect to other section portions, described carrier or described unloading part and can change.

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