Thermocurable bonding agent and laminated resin type IC-card

Thermocurable bonding agent and laminated resin type IC-card

  • CN 102,057,011 B
  • Filed: 06/10/2009
  • Issued: 05/04/2016
  • Est. Priority Date: 06/10/2008
  • Status: Active Grant
First Claim
Patent Images

1. a Thermocurable bonding agent, is characterized in that, it contains:

  • (a) there is the amorphous polyester resin of hydroxyl;

    (b) curing agent;

    And(c) have the solvent that the amorphous polyester resin (a) of hydroxyl dissolves described in making, wherein, described curing agent is styrene-MaCarry out acid anhydride copolymer.

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