Package with power and ground through via

Package with power and ground through via

  • CN 102,057,481 A
  • Filed: 01/07/2009
  • Published: 05/11/2011
  • Est. Priority Date: 09/09/2008
  • Status: Active Application
First Claim
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1. wire bond designing integrated circuit comprises:

  • Substrate with positive and opposite back side,Be arranged on the circuit on the described front,Be arranged to pass the conductive through hole of described substrate to the described back side from described front, described conductive through hole is electrically connected to described circuit, so that described conductive through hole is only for described circuit provides the service of power supply and ground connection, andBe arranged on the pad on the described front, described pad is electrically connected to described circuit, so that described pad only provides signal communication for described circuit.

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